Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11478869 | Method for forming bump electrode substrate | Hiroki Sudo, Hiroshi Okada, Daisuke Souma | 2022-10-25 |
| 11465244 | Solder alloy, solder ball, chip solder, solder paste and solder joint | Ken Tachibana | 2022-10-11 |