Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488936 | Stacked silicon package assembly having vertical thermal management | Suresh Ramalingam, Jaspreet S. Gandhi, Cheang-Whang Chang | 2022-11-01 |
| 11488887 | Thermal enablement of dies with impurity gettering | Suresh Ramalingam, Boon Yong Ang, Toshiyuki Hisamura, Suresh Parameswaran, Scott McCann +1 more | 2022-11-01 |
| 11476556 | Remote active cooling heat exchanger and antenna system with the same | Mohsen H. Mardi, Suresh Ramalingam, Volker Aue | 2022-10-18 |
| 11469212 | Semiconductor chip with redundant thru-silicon-vias | Bryan Black, Michael Z. Su, Joe Siegel, Seth Prejean | 2022-10-11 |
| 11373929 | Thermal heat spreader plate for electronic device | Chi-Yi Chao, Suresh Ramalingam, Hoa Do, Anthony Torza, Brian D. Philofsky +1 more | 2022-06-28 |
| 11355412 | Stacked silicon package assembly having thermal management | Jaspreet S. Gandhi, Henley Liu, Myongseob Kim, Tien-Yu Lee, Suresh Ramalingam +1 more | 2022-06-07 |
| 11330738 | Force balanced package mounting | Chi-Yi Chao, Huayan Wang, Suresh Ramalingam, Volker Aue | 2022-05-10 |
| 11328976 | Three-dimensional thermal management apparatuses for electronic devices | Chi-Yi Chao, Suresh Ramalingam, Hoa Do, Anthony Torza, Brian D. Philofsky | 2022-05-10 |
| 11246211 | Micro device with through PCB cooling | Nagadeven Karunakaran, Hoa Do, Suresh Ramalingam | 2022-02-08 |