Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538633 | Combination stiffener and capacitor | Jiun Hann Sir, Min Suet Lim | 2022-12-27 |
| 11445608 | Chassis interconnect for an electronic device | Chee How Lim, Jon Sern Lim, Khai Ern See, Min Suet Lim, Tin Poay Chuah +1 more | 2022-09-13 |
| 11393760 | Floating-bridge interconnects and methods of assembling same | Boon Ping Koh, Jiun Hann Sir, Khang Choong Yong, Min Suet Lim, Wil Choon Song | 2022-07-19 |
| 11322434 | Top-to-bottom interconnects with molded lead-frame module for integrated-circuit packages | Jiun Hann Sir, Poh Boon Khoo | 2022-05-03 |
| 11304299 | Board to board interconnect | Chee Ling Wong, Wil Choon Song, Khang Choong Yong, Mohd Muhaiyiddin Bin Abdullah, Tin Poay Chuah | 2022-04-12 |
| 11289414 | Systems, methods, and apparatuses for implementing a pad on solder mask (POSM) semiconductor substrate package | Jiun Hann Sir, Min Suet Lim | 2022-03-29 |
| 11264160 | Extended package air core inductor | Jiun Hann Sir, Min Suet Lim, Chin Lee Kuan, Siew Fong Yap | 2022-03-01 |
| 11264315 | Electronic package with passive component between substrates | Min Suet Lim, Jiun Hann Sir, Hoay Tien Teoh, Jimmy Huang | 2022-03-01 |