Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450588 | Method for forming chip package structure with heat conductive layer | Shin CHI, Chien-Hao Hsu, Kuo-Chin Chang, Mirng-Ji Lii | 2022-09-20 |
| 11329017 | Semiconductor device package and method of manufacturing the same | Wei-Tung CHANG | 2022-05-10 |
| 11316274 | Semiconductor device package and method of manufacturing the same | Hsu-Nan FANG | 2022-04-26 |