Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322588 | Contact source/drain resistance | Fee Li Lie, Choonghyun Lee, Kangguo Cheng, Hemanth Jagannathan | 2022-05-03 |
| 11309216 | Large grain copper interconnect lines for MRAM | Alexander Reznicek, Yasir Sulehria, Devika Sil | 2022-04-19 |
| 11227922 | Sloped epitaxy buried contact | Tao Li, Tsung-Sheng Kang, Ruilong Xie, Alexander Reznicek | 2022-01-18 |