Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515191 | Graded dimple height pattern on heater for lower backside damage and low chucking voltage | Vivek Shah, Bhaskar Kumar | 2022-11-29 |
| 11495440 | Plasma density control on substrate edge | Bhaskar Kumar, Prashanth Kothnur, Sidharth Bhatia, Anup K. Singh, Vivek Shah +1 more | 2022-11-08 |
| 11488811 | Chucking process and system for substrate processing chambers | Bhaskar Kumar, Vivek Shah, Jiheng Zhao | 2022-11-01 |
| 11451389 | Multi-encrypted message response manager | Madhusudhanan Krishnamoorthy | 2022-09-20 |
| 11437262 | Wafer de-chucking detection and arcing prevention | Byung Chul Yoon, Hemant P. Mungekar | 2022-09-06 |
| 11318642 | Permeable wall encapsulation mold | Louis G. Campbell | 2022-05-03 |
| 11276562 | Plasma processing using multiple radio frequency power feeds for improved uniformity | Zheng John Ye, Thuy Britcher, Jay D. Pinson, II, Hiroji Hanawa, Juan Carlos Rocha-Alvarez +4 more | 2022-03-15 |