Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145610 | Chip package structure having at least one chip and at least one thermally conductive element and manufacturing method thereof | John Hon-Shing Lau, Yu-Chi Shen, Chen-Hua Cheng, Pei-Wei Wang | 2021-10-12 |
| 11127664 | Circuit board and manufacturing method thereof | Ra-Min Tain, Kai-Ming Yang, Wang-Hsiang Tsai | 2021-09-21 |
| 11114782 | Method of manufacturing circuit board structure | Pei-Wei Wang, Ching-Ho Hsieh, Shao-Chien Lee, Kuo-Wei Li | 2021-09-07 |
| 10957658 | Package structure with structure reinforcing element and manufacturing method thereof | Pu-Ju Lin, Cheng-Ta Ko, Yu-Hua Chen, Ra-Min Tain | 2021-03-23 |
| 10925172 | Carrier structure and manufacturing method thereof | Cheng-Ta Ko, Pu-Ju Lin, Tse-Wei Wang | 2021-02-16 |
| 10897823 | Circuit board, package structure and method of manufacturing the same | Cheng-Ta Ko, Kai-Ming Yang, Chih-Lun Wang | 2021-01-19 |