Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11166387 | Wiring board and manufacturing method thereof | Chen-Hao Lin, Pu-Ju Lin | 2021-11-02 |
| 11127664 | Circuit board and manufacturing method thereof | Ra-Min Tain, Wang-Hsiang Tsai, Tzyy-Jang Tseng | 2021-09-21 |
| 11013103 | Method for forming circuit board stacked structure | Ra-Min Tain, Chien-Tsai Li | 2021-05-18 |
| 10993332 | Circuit substrate | Chen-Hao Lin | 2021-04-27 |
| 10897823 | Circuit board, package structure and method of manufacturing the same | Tzyy-Jang Tseng, Cheng-Ta Ko, Chih-Lun Wang | 2021-01-19 |