Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11166387 | Wiring board and manufacturing method thereof | Kai-Ming Yang, Pu-Ju Lin | 2021-11-02 |
| 10993332 | Circuit substrate | Kai-Ming Yang | 2021-04-27 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11166387 | Wiring board and manufacturing method thereof | Kai-Ming Yang, Pu-Ju Lin | 2021-11-02 |
| 10993332 | Circuit substrate | Kai-Ming Yang | 2021-04-27 |