Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11166387 | Wiring board and manufacturing method thereof | Kai-Ming Yang, Chen-Hao Lin | 2021-11-02 |
| 10957658 | Package structure with structure reinforcing element and manufacturing method thereof | Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng, Ra-Min Tain | 2021-03-23 |
| 10950535 | Package structure and method of manufacturing the same | Chun-Min Wang, Cheng-Ta Ko | 2021-03-16 |
| 10925172 | Carrier structure and manufacturing method thereof | Tzyy-Jang Tseng, Cheng-Ta Ko, Tse-Wei Wang | 2021-02-16 |