Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10957658 | Package structure with structure reinforcing element and manufacturing method thereof | Pu-Ju Lin, Yu-Hua Chen, Tzyy-Jang Tseng, Ra-Min Tain | 2021-03-23 |
| 10950535 | Package structure and method of manufacturing the same | Chun-Min Wang, Pu-Ju Lin | 2021-03-16 |
| 10925172 | Carrier structure and manufacturing method thereof | Tzyy-Jang Tseng, Pu-Ju Lin, Tse-Wei Wang | 2021-02-16 |
| 10897823 | Circuit board, package structure and method of manufacturing the same | Tzyy-Jang Tseng, Kai-Ming Yang, Chih-Lun Wang | 2021-01-19 |