Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127664 | Circuit board and manufacturing method thereof | Kai-Ming Yang, Wang-Hsiang Tsai, Tzyy-Jang Tseng | 2021-09-21 |
| 11013103 | Method for forming circuit board stacked structure | Kai-Ming Yang, Chien-Tsai Li | 2021-05-18 |
| 10957658 | Package structure with structure reinforcing element and manufacturing method thereof | Pu-Ju Lin, Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng | 2021-03-23 |
| 10888001 | Circuit carrier board structure and manufacturing method thereof | Wei-Ti Lin, Chun-Hsien Chien, Chien-Chou Chen, Fu-Yang Chen | 2021-01-05 |