Issued Patents 2021
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201123 | Substrate structure and manufacturing method thereof | Po-Chen Lin, Wen-Liang Yeh, Chien-Chou Chen | 2021-12-14 |
| 11139234 | Package carrier and manufacturing method thereof | Wei-Ti Lin, Yu-Hua Chen | 2021-10-05 |
| 11037869 | Package structure and preparation method thereof | Fu-Yang Chen, Cheng-Hui Wu, Wei-Ti Lin | 2021-06-15 |
| 11032917 | Circuit carrier board and manufacturing method thereof | Wei-Ti Lin, Fu-Yang Chen | 2021-06-08 |
| 10999939 | Circuit carrier board and manufacturing method thereof | Wen-Liang Yeh, Wei-Ti Lin | 2021-05-04 |
| 10950687 | Manufacturing method of substrate structure | Yu-Hua Chen, Fu-Yang Chen, Chien-Chou Chen, Wei-Ti Lin | 2021-03-16 |
| 10937723 | Package carrier structure having integrated circuit design and manufacturing method thereof | Yu-Chung Hsieh, Yu-Hua Chen | 2021-03-02 |
| 10886264 | Manufacturing method of light-emitting diode package structure | Wei-Ti Lin, Fu-Yang Chen | 2021-01-05 |
| 10888001 | Circuit carrier board structure and manufacturing method thereof | Wei-Ti Lin, Chien-Chou Chen, Fu-Yang Chen, Ra-Min Tain | 2021-01-05 |