Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145610 | Chip package structure having at least one chip and at least one thermally conductive element and manufacturing method thereof | John Hon-Shing Lau, Yu-Chi Shen, Tzyy-Jang Tseng, Chen-Hua Cheng | 2021-10-12 |
| 11114782 | Method of manufacturing circuit board structure | Tzyy-Jang Tseng, Ching-Ho Hsieh, Shao-Chien Lee, Kuo-Wei Li | 2021-09-07 |