Issued Patents 2021
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11018091 | Eliminate sawing-induced peeling through forming trenches | Hsien-Wei Chen | 2021-05-25 |
| 11018892 | Broadband remote access server (BRAS) system-based packet encapsulation | Zhouyi Yu, Hongtao Guo, Qian Cao | 2021-05-25 |
| 11018070 | Semiconductor die, manufacturing method thereof, and semiconductor package | Hsien-Wei Chen, Ming-Fa Chen | 2021-05-25 |
| 11004838 | Packaged die and RDL with bonding structures therebetween | Hsien-Wei Chen | 2021-05-11 |
| 10998293 | Method of fabricating semiconductor structure | Hsien-Wei Chen, Ming-Fa Chen, Ching-Jung Yang | 2021-05-04 |
| 10984041 | Natural language processing integrated with database and data storage management | Pavan Kumar Reddy Bedadala, Shilpa Nagendra, Rajesh Polimera, Aakash Chakravarthy Vijayakumar, Neha Mathur +8 more | 2021-04-20 |
| 10964659 | Semiconductor device | Ying-Ju Chen, Hsien-Wei Chen, Tsung-Yuan Yu | 2021-03-30 |
| 10943889 | Semiconductor device and method of manufacture | Hsien-Wei Chen, Ying-Ju Chen, An-Jhih Su | 2021-03-09 |
| 10930633 | Buffer design for package integration | Hsien-Wei Chen, Ming-Fa Chen, Chen-Hua Yu | 2021-02-23 |
| 10924758 | Method and apparatus for determining a motion vector | Jun Zhang, Yue Wu | 2021-02-16 |
| 10914043 | Construction method for a cantilever beam on a central pier | Gangliang Liu, Chengmin Wang, Zhongwen Wang, Yiming Xu, Rongfeng Chen +6 more | 2021-02-09 |
| 10904520 | Method and device for indicating pixel, and method and device for processing pixel indication | Sunil Lee | 2021-01-26 |
| 10892405 | Hall-effect sensor package with added current path | Ming Li, Yiqi Tang, Enis Tuncer, Usman Mahmood Chaudhry, Tony R. Larson +3 more | 2021-01-12 |
| 10886245 | Semiconductor structure, 3DIC structure and method of fabricating the same | Hsien-Wei Chen, Ming-Fa Chen, Sung-Feng Yeh | 2021-01-05 |
| 10886238 | Supporting InFO packages to reduce warpage | Ying-Ju Chen, Hsien-Wei Chen | 2021-01-05 |