Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11135779 | Ultrasonic bonding apparatus and ultrasonic bonding method using the same | Hyun A Lee, Chan-Jae Park, HEEJU WOO, Kikyung Youk, Daehwan Jang | 2021-10-05 |
| 10937741 | Molded laser package with electromagnetic interference shield and method of making | DeokKyung Yang, HunTeak Lee, HeeSoo Lee, Wanil Lee | 2021-03-02 |