Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11135779 | Ultrasonic bonding apparatus and ultrasonic bonding method using the same | Hyun A Lee, HEEJU WOO, Kikyung Youk, SANGDUK LEE, Daehwan Jang | 2021-10-05 |
CP
Chan-Jae Park
Overall (2021): #496,794 of 548,734Top 95%
1
Patents 2021