KY

Kikyung Youk

Samsung: 1 patents #7,111 of 16,990Top 45%
📍 Bucheon-si, KR: #52 of 159 inventorsTop 35%
Overall (2021): #371,771 of 548,734Top 70%
1
Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11135779 Ultrasonic bonding apparatus and ultrasonic bonding method using the same Hyun A Lee, Chan-Jae Park, HEEJU WOO, SANGDUK LEE, Daehwan Jang 2021-10-05