Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11135779 | Ultrasonic bonding apparatus and ultrasonic bonding method using the same | Hyun A Lee, Chan-Jae Park, HEEJU WOO, Kikyung Youk, SANGDUK LEE | 2021-10-05 |
DJ
Daehwan Jang
Overall (2021): #483,855 of 548,734Top 90%
1
Patents 2021