Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11135779 | Ultrasonic bonding apparatus and ultrasonic bonding method using the same | Hyun A Lee, Chan-Jae Park, Kikyung Youk, SANGDUK LEE, Daehwan Jang | 2021-10-05 |
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Overall (2021): #435,556 of 548,734Top 80%
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Patents 2021