Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189598 | Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same | DeokKyung Yang, HunTeak Lee, Sungsoo Kim | 2021-11-30 |
| 10999035 | Method for mitigation of multiple access interference in mobile communication system and apparatus for the same | Eun Kyung Kim, Tae-Joong Kim, Hyun Seo PARK, An Seok LEE, Yu Ro LEE +1 more | 2021-05-04 |
| 10937741 | Molded laser package with electromagnetic interference shield and method of making | DeokKyung Yang, HunTeak Lee, Wanil Lee, SANGDUK LEE | 2021-03-02 |
| 10938534 | Carrier aggregation in wireless communication systems | Young Jo Ko, Tae Gyun Noh, Kyoung Seok Lee, Bang Won SEO, Byung Jang Jeong | 2021-03-02 |