Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081455 | Semiconductor device with bond pad extensions formed on molded appendage | Chan Lam Cha, Thorsten Meyer, Klaus Schiess, Guan Choon Matthew Nelson Tee | 2021-08-03 |
| 11075185 | Semiconductor package with multi-level conductive clip for top side cooling | Chii Shang Hong, Ivan Nikitin, Chiew Li Tai | 2021-07-27 |
| 10978380 | Semiconductor package with multi-level conductive clip for top side cooling | Chii Shang Hong, Chiew Li Tai | 2021-04-13 |