Issued Patents 2021
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201138 | Wafer level integration including design/co-design, structure process, equipment stress management and thermal management | Bing Dang, Li-Wen Hung, John U. Knickerbocker | 2021-12-14 |
| 11195773 | Flip chip assembly of quantum computing devices | Hanhee Paik, Jerry M. Chow | 2021-12-07 |
| 11183725 | Low-profile battery construct with engineered interfaces | Paul S. Andry, Paul A. Lauro, Adinath S. Narasgond, Robert J. Polastre, Bucknell C. Webb | 2021-11-23 |
| 11165010 | Cold-welded flip chip interconnect structure | Eric P. Lewandowski, Nicholas Torleiv Bronn | 2021-11-02 |
| 11158781 | Permanent wafer handlers with through silicon vias for thermalization and qubit modification | Li-Wen Hung, Eric P. Lewandowski, Adinath S. Narasgond | 2021-10-26 |
| 11110534 | Continuous solder transfer to substrates | Stephen L. Buchwalter, Peter A. Gruber, Da-Yuan Shih, Paul A. Lauro | 2021-09-07 |
| 11043690 | Sandwich-parallel micro-battery | Paul S. Andry, Eric P. Lewandowski, Bucknell C. Webb, Adinath S. Narasgond, Bo Wen | 2021-06-22 |
| 10964925 | Hermetial via seal for thin film battery | Bing Dang, Qianwen Chen, Yu Luo, John U. Knickerbocker, Kai Liu +4 more | 2021-03-30 |
| 10937735 | Hybrid under-bump metallization component | Eric P. Lewandowski, Adinath S. Narasgond | 2021-03-02 |