Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11135779 | Ultrasonic bonding apparatus and ultrasonic bonding method using the same | Chan-Jae Park, HEEJU WOO, Kikyung Youk, SANGDUK LEE, Daehwan Jang | 2021-10-05 |
HL
Hyun A Lee
Overall (2021): #426,877 of 548,734Top 80%
1
Patents 2021