Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177228 | Semiconductor device and bump formation process | Sheng-Yu Wu, Ching-Hui Chen, Mirng-Ji Lii, Kai-Di Wu, Chao-Yi Wang +3 more | 2021-11-16 |
| 11140983 | Slide rail assembly | Ken-Ching Chen, Shih-Lung Huang, Chun-Chiang Wang | 2021-10-12 |
| 11127703 | Semiconductor devices | Chin-Yu Ku, Cheng-Lung Yang, Chen-Shien Chen, Hon-Lin Huang, Chao-Yi Wang +1 more | 2021-09-21 |
| 11081459 | Semiconductor device | Chin-Yu Ku, Hon-Lin Huang, Chao-Yi Wang, Chen-Shien Chen | 2021-08-03 |