Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205639 | Integrated circuit device with stacked dies having mirrored circuitry | Myongseob Kim, Henley Liu | 2021-12-21 |
| 11145566 | Stacked silicon package assembly having thermal management | Gamal Refai-Ahmed, Suresh Ramalingam, Jaspreet S. Gandhi | 2021-10-12 |
| 11114344 | IC die with dummy structures | Hui-Wen Lin, Nui Chong, Myongseob Kim, Henley Liu, Ping-Chin Yeh | 2021-09-07 |
| 11054461 | Test circuits for testing a die stack | Nui Chong, Amitava Majumdar, Henley Liu, Myongseob Kim, Albert Shih-Huai Lin | 2021-07-06 |