Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081828 | Power module housing | Jihwan Kim, Yushuang YAO, Bosung WON, Olaf Zschieschang | 2021-08-03 |
| D922329 | Press-fit pin case | Jihwan Kim, Yushuang YAO, Bosung WON, Olaf Zschieschang | 2021-06-15 |
| 10971428 | Semiconductor baseplates | Francis J. Carney, Chee Hiong CHEW, Yushuang YAO | 2021-04-06 |
| 10971429 | Method for forming a semiconductor package | Soon Wei WANG, Hoe Kit Liew How Kat Ley | 2021-04-06 |
| 10966335 | Fin frame assemblies | Chee Hiong CHEW, Yushuang YAO | 2021-03-30 |
| 10897821 | Method of making single reflow power pin connections | Yushuang YAO, Chee Hiong CHEW, Francis J. Carney, Yusheng LIN | 2021-01-19 |