Issued Patents 2021
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11209476 | Semiconductor inspection device | Yoshitaka Iwaki | 2021-12-28 |
| 11201132 | Method for setting conditions for heating semiconductor chip during bonding, method for measuring viscosity of non-conductive film, and bonding apparatus | Toru Maeda, Satoru Nagai, Yoshihiro Saeki, Osamu Watanabe | 2021-12-14 |
| 11189594 | Bonding apparatus and bonding method | Osamu Watanabe, Yoshihito Hagiwara | 2021-11-30 |
| 11172600 | Mounting device | Toru Maeda | 2021-11-09 |
| 11094567 | Mounting apparatus and method for manufacturing semiconductor device | Toru Maeda, Tetsuo Takano | 2021-08-17 |
| 11069650 | Bonding condition evaluation apparatus | — | 2021-07-20 |
| 11069651 | Method of mounting die | Osamu Watanabe, Yoshihito Hagiwara, Yuji Kanai | 2021-07-20 |
| 11047792 | Semiconductor device inspection method and semiconductor device inspection apparatus | Akihiro Otaka | 2021-06-29 |
| 11028426 | Nucleic acid sequence amplification method | Mitinori Saitou, Yukihiro Yabuta | 2021-06-08 |
| 11024596 | Bonding apparatus and bonding method | Osamu Watanabe, Toru Maeda, Satoru Nagai, Yuichiro Noguchi | 2021-06-01 |
| 11009531 | Image generating method, image generating device, image generating program, and storage medium | Akihiro Otaka | 2021-05-18 |
| 10978420 | Semiconductor chip mounting apparatus and semiconductor chip mounting method | Yoshihito Hagiwara, Hiroshi Horibe | 2021-04-13 |
| 10976284 | Inspection device and inspection method | — | 2021-04-13 |
| 10937758 | Semiconductor-device manufacturing method and manufacturing apparatus | Takehito Shimatsu, Miyuki UOMOTO | 2021-03-02 |
| 10896901 | Method of manufacturing semiconductor device, and mounting device | Toru Maeda | 2021-01-19 |