Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201132 | Method for setting conditions for heating semiconductor chip during bonding, method for measuring viscosity of non-conductive film, and bonding apparatus | Tomonori Nakamura, Satoru Nagai, Yoshihiro Saeki, Osamu Watanabe | 2021-12-14 |
| 11172600 | Mounting device | Tomonori Nakamura | 2021-11-09 |
| 11094567 | Mounting apparatus and method for manufacturing semiconductor device | Tomonori Nakamura, Tetsuo Takano | 2021-08-17 |
| 11024596 | Bonding apparatus and bonding method | Osamu Watanabe, Tomonori Nakamura, Satoru Nagai, Yuichiro Noguchi | 2021-06-01 |
| 10896901 | Method of manufacturing semiconductor device, and mounting device | Tomonori Nakamura | 2021-01-19 |