Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201132 | Method for setting conditions for heating semiconductor chip during bonding, method for measuring viscosity of non-conductive film, and bonding apparatus | Tomonori Nakamura, Toru Maeda, Satoru Nagai, Yoshihiro Saeki | 2021-12-14 |
| 11189594 | Bonding apparatus and bonding method | Yoshihito Hagiwara, Tomonori Nakamura | 2021-11-30 |
| 11135422 | Bio-electrode and methods for manufacturing the bio-electrode | Jun Hatakeyama, Motoaki Iwabuchi, Takayuki Fujiwara, Yasuyoshi Kuroda | 2021-10-05 |
| 11071485 | Bio-electrode composition, bio-electrode, and method for manufacturing bio-electrode | Jun Hatakeyama, Koji Hasegawa, Motoaki Iwabuchi | 2021-07-27 |
| 11069651 | Method of mounting die | Tomonori Nakamura, Yoshihito Hagiwara, Yuji Kanai | 2021-07-20 |
| 11043085 | Self-service point-of-sale terminal | Keiichi Saito | 2021-06-22 |
| 11024596 | Bonding apparatus and bonding method | Tomonori Nakamura, Toru Maeda, Satoru Nagai, Yuichiro Noguchi | 2021-06-01 |