Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189594 | Bonding apparatus and bonding method | Osamu Watanabe, Tomonori Nakamura | 2021-11-30 |
| 11069651 | Method of mounting die | Osamu Watanabe, Tomonori Nakamura, Yuji Kanai | 2021-07-20 |
| 10978420 | Semiconductor chip mounting apparatus and semiconductor chip mounting method | Tomonori Nakamura, Hiroshi Horibe | 2021-04-13 |