Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201132 | Method for setting conditions for heating semiconductor chip during bonding, method for measuring viscosity of non-conductive film, and bonding apparatus | Tomonori Nakamura, Toru Maeda, Yoshihiro Saeki, Osamu Watanabe | 2021-12-14 |
| 11024596 | Bonding apparatus and bonding method | Osamu Watanabe, Tomonori Nakamura, Toru Maeda, Yuichiro Noguchi | 2021-06-01 |