Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158607 | Wafer reconstitution and die-stitching | Sanjay Dabral, Jun Zhai, Kwan-Yu Lai, Vidhya Ramachandran | 2021-10-26 |
| 11158621 | Double side mounted large MCM package with memory channel length reduction | Chonghua Zhong, Jun Zhai | 2021-10-26 |
| 11056373 | 3D fanout stacking | Jun Zhai, Kwan-Yu Lai | 2021-07-06 |
| 10943869 | High density interconnection using fanout interposer chiplet | Jun Zhai, Chonghua Zhong | 2021-03-09 |