Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158607 | Wafer reconstitution and die-stitching | Sanjay Dabral, Jun Zhai, Kunzhong Hu, Vidhya Ramachandran | 2021-10-26 |
| 11056373 | 3D fanout stacking | Jun Zhai, Kunzhong Hu | 2021-07-06 |