Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158607 | Wafer reconstitution and die-stitching | Jun Zhai, Kwan-Yu Lai, Kunzhong Hu, Vidhya Ramachandran | 2021-10-26 |
| 11101732 | Power management system switched capacitor voltage regulator with integrated passive device | David A. Secker, Jun Zhai, Ralf M. Schmitt, Vidhya Ramachandran, Wenjie Mao | 2021-08-24 |
| 10985107 | Systems and methods for forming die sets with die-to-die routing and metallic seals | Jun Zhai | 2021-04-20 |