Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158621 | Double side mounted large MCM package with memory channel length reduction | Chonghua Zhong, Kunzhong Hu | 2021-10-26 |
| 11158607 | Wafer reconstitution and die-stitching | Sanjay Dabral, Kwan-Yu Lai, Kunzhong Hu, Vidhya Ramachandran | 2021-10-26 |
| 11101732 | Power management system switched capacitor voltage regulator with integrated passive device | Sanjay Dabral, David A. Secker, Ralf M. Schmitt, Vidhya Ramachandran, Wenjie Mao | 2021-08-24 |
| 11069665 | Trimmable banked capacitor | Vidhya Ramachandran, Chonghua Zhong, Long Huang, Mengzhi Pang, Rohan U. Mandrekar | 2021-07-20 |
| 11063046 | Multi-die fine grain integrated voltage regulation | Jared L. Zerbe, Emerson S. Fang, Shawn Searles | 2021-07-13 |
| 11056373 | 3D fanout stacking | Kwan-Yu Lai, Kunzhong Hu | 2021-07-06 |
| 10985107 | Systems and methods for forming die sets with die-to-die routing and metallic seals | Sanjay Dabral | 2021-04-20 |
| 10943869 | High density interconnection using fanout interposer chiplet | Chonghua Zhong, Kunzhong Hu | 2021-03-09 |