Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11063046 | Multi-die fine grain integrated voltage regulation | Jared L. Zerbe, Jun Zhai, Shawn Searles | 2021-07-13 |
| 11023403 | Chip to chip interface with scalable bandwidth | Jafar Savoj, Jose A. Tierno, Sanjeev K. Maheshwari, Brian S. Leibowitz, Pradeep Trivedi +1 more | 2021-06-01 |