Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158621 | Double side mounted large MCM package with memory channel length reduction | Jun Zhai, Kunzhong Hu | 2021-10-26 |
| 11069665 | Trimmable banked capacitor | Vidhya Ramachandran, Jun Zhai, Long Huang, Mengzhi Pang, Rohan U. Mandrekar | 2021-07-20 |
| 10943869 | High density interconnection using fanout interposer chiplet | Jun Zhai, Kunzhong Hu | 2021-03-09 |