Issued Patents 2020
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879266 | Semiconductor device and operating method thereof | Guan-Wei Wu, I-Chen Yang | 2020-12-29 |
| 10796954 | Semiconductor structure and method for forming the same | Gung-Pei Chang, Hai-Dang Trinh | 2020-10-06 |
| 10790362 | Semiconductor structure and manufacturing method of the same | Gung-Pei Chang, Ching-Sheng Chu, Chern-Yow Hsu | 2020-09-29 |
| 10770144 | Non-volatile memory and program method thereof | Hsing-Wen Chang | 2020-09-08 |
| 10763273 | Vertical GAA flash memory including two-transistor memory cells | Guan-Wei Wu, I-Chen Yang | 2020-09-01 |
| 10741262 | NAND flash operating techniques mitigating program disturbance | Wei-Liang Lin, Chun-Chang Lu, Wen-Jer Tsai, Guan-Wei Wu | 2020-08-11 |
| 10741250 | Non-volatile memory device and driving method thereof | Hsing-Wen Chang, Chi-Yuan Chin | 2020-08-11 |
| 10727399 | Top electrode cap structure for embedded memory | Tsung-Hsueh Yang | 2020-07-28 |
| 10727077 | Structure and method to expose memory cells with different sizes | Sheng-Chau Chen, Cheng-Tai Hsiao, Cheng-Yuan Tsai, Hsun-Chung Kuang | 2020-07-28 |
| 10713410 | Method for legalizing mixed-cell height standard cells of IC | Chao Wang, Yen-Yi Wu, Shih-Chun Chen, Meng-Kai Hsu | 2020-07-14 |
| 10658318 | Film scheme for bumping | Chern-Yow Hsu, Cheng-Yuan Tsai, Kong-Beng Thei | 2020-05-19 |
| 10558779 | Method of redistribution layer routing for 2.5-dimensional integrated circuit packages | Chun-Han Chiang, Fu-Yu Chuang, Chih-Che Lin, Chun-Yi Yang | 2020-02-11 |