Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10558779 | Method of redistribution layer routing for 2.5-dimensional integrated circuit packages | Chun-Han Chiang, Yao-Wen Chang, Chih-Che Lin, Chun-Yi Yang | 2020-02-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10558779 | Method of redistribution layer routing for 2.5-dimensional integrated circuit packages | Chun-Han Chiang, Yao-Wen Chang, Chih-Che Lin, Chun-Yi Yang | 2020-02-11 |