Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840371 | Ultra high voltage semiconductor device with electrostatic discharge capabilities | Tsai-Feng Yang, Chih-Heng Shen, Kun-Ming Huang, Po-Tao Chu, Shen-Ping Wang | 2020-11-17 |
| 10804231 | Passivation scheme for pad openings and trenches | Ming-Hong Chang, Kun-Ming Huang, Po-Tao Chu, Shen-Ping Wang, Chien-Li Kuo | 2020-10-13 |
| 10558779 | Method of redistribution layer routing for 2.5-dimensional integrated circuit packages | Chun-Han Chiang, Fu-Yu Chuang, Yao-Wen Chang, Chih-Che Lin | 2020-02-11 |