Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10868110 | Low warpage high density trench capacitor | Jyun-Ying Lin, Hsin-Li Cheng, Jing-Hwang Yang, Felix Ying-Kit Tsui | 2020-12-15 |
| 10861832 | Package structure and method of manufacturing the same | — | 2020-12-08 |
| 10825905 | Thin poly field plate design | Scott Liu, Po-Wei Chen, Shih-Hsiang Tai | 2020-11-03 |
| 10804231 | Passivation scheme for pad openings and trenches | Ming-Hong Chang, Chun-Yi Yang, Kun-Ming Huang, Po-Tao Chu, Shen-Ping Wang | 2020-10-13 |
| 10714452 | Package structure and method of manufacturing the same | — | 2020-07-14 |
| 10686054 | Semiconductor device | Jheng-Sheng YOU, Hsin-Chih Lin, Kun-Ming Huang, Lieh-Chuan Chen, Po-Tao Chu +1 more | 2020-06-16 |