Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879629 | Method of electroplating metal into recessed feature and electroplating layer in recessed feature | Jyun-Ru Wu, Shiu-Ko JangJian, Yu-Ren PENG, Chi-Cheng Hung, Yu-Sheng Wang | 2020-12-29 |
| 10840184 | Formation of copper layer structure with self anneal strain improvement | Shiu-Ko JangJian, Chi-Cheng Hung, Yu-Sheng Wang, Hung-Hsu Chen | 2020-11-17 |
| 10749278 | Method of electroplating metal into recessed feature and electroplating layer in recessed feature | Jyun-Ru Wu, Shiu-Ko JangJian, Yu-Ren PENG, Chi-Cheng Hung, Yu-Sheng Wang | 2020-08-18 |