Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840184 | Formation of copper layer structure with self anneal strain improvement | Jun-Nan Nian, Shiu-Ko JangJian, Chi-Cheng Hung, Yu-Sheng Wang | 2020-11-17 |
| 10755917 | Treatment for adhesion improvement | Ching-Yi Chen, Wei-Yip Loh, Chih-Wei Chang | 2020-08-25 |
| 10535748 | Method of forming a contact with a silicide region | Yu-Wen Cheng, Cheng-Tung Lin, Chih-Wei Chang, Hong-Mao Lee, Ming-Hsing Tsai +6 more | 2020-01-14 |