Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10833394 | Electronic package and method for fabricating the same | Wen-Jung Tsai, Mao-Hua Yeh, Ying-Chou Tsai, Chun-Chi Ke | 2020-11-10 |
| 10818515 | Electronic package and method for fabricating the same | Yu-Wei Yeh, Yen-Hung Lin, Chih-Yi Liao | 2020-10-27 |
| 10811378 | Electronic package and manufacturing method thereof | — | 2020-10-20 |
| 10643974 | Electronic package with conductive pillars | Chia-Yang Chen, Chih-Chiang He | 2020-05-05 |
| 10587041 | Electronic package structure and fabrication method thereof | Chih-Yuan Shih, Yueh-Chiung Chang, Tsung Li Lin, Chi-Pin Tsai, Chien-Cheng Lin +3 more | 2020-03-10 |
| 10587037 | Electronic package structure | Heng-Cheng Chu, Chien-Cheng Lin, Tsung-Hsien Tsai, Chao-Ya Yang, Yude Chu | 2020-03-10 |
| 10573623 | Electronic package structure with multiple electronic components | — | 2020-02-25 |