Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10833394 | Electronic package and method for fabricating the same | Wen-Jung Tsai, Mao-Hua Yeh, Chih-Hsien Chiu, Ying-Chou Tsai | 2020-11-10 |
| 10566271 | Carrier-free semiconductor package and fabrication method | Yueh-Ying Tsai, Fu Tang, Chien-Ping Huang | 2020-02-18 |