Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872847 | Package structure and method for fabricating the same | Shao-Tzu Tang, Jia-Fong Yeh, Yi-Hsuan Liu, Mei-Chi Chen | 2020-12-22 |
| 10833394 | Electronic package and method for fabricating the same | Wen-Jung Tsai, Mao-Hua Yeh, Chih-Hsien Chiu, Chun-Chi Ke | 2020-11-10 |