Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872847 | Package structure and method for fabricating the same | Jia-Fong Yeh, Yi-Hsuan Liu, Mei-Chi Chen, Ying-Chou Tsai | 2020-12-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872847 | Package structure and method for fabricating the same | Jia-Fong Yeh, Yi-Hsuan Liu, Mei-Chi Chen, Ying-Chou Tsai | 2020-12-22 |