Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10587037 | Electronic package structure | Chih-Hsien Chiu, Heng-Cheng Chu, Tsung-Hsien Tsai, Chao-Ya Yang, Yude Chu | 2020-03-10 |
| 10587041 | Electronic package structure and fabrication method thereof | Chih-Yuan Shih, Chih-Hsien Chiu, Yueh-Chiung Chang, Tsung Li Lin, Chi-Pin Tsai +3 more | 2020-03-10 |