Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10587041 | Electronic package structure and fabrication method thereof | Chih-Hsien Chiu, Yueh-Chiung Chang, Tsung Li Lin, Chi-Pin Tsai, Chien-Cheng Lin +3 more | 2020-03-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10587041 | Electronic package structure and fabrication method thereof | Chih-Hsien Chiu, Yueh-Chiung Chang, Tsung Li Lin, Chi-Pin Tsai, Chien-Cheng Lin +3 more | 2020-03-10 |